MINIOVEN 05

Compact hybrid reflow oven
For reball and reflow processes on BGA, CSP and QFN components at the best temperature distribution.
Products in shop
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Minioven-05-Front01
Minioven-05-Rechts
Minioven-05-Back
Minioven-05-LInks
Minioven-05-Top

Top FeaturesHybrid heating technology for the best temperature distribution

Process reliability
Optimized heat distribution via convection
Flexibility
Reflow of solder paste or solder balls
Plug and Play
Compact format, innovative design and intuitive operation
Precision
Nitrogen connection for optimal reflow of solder balls
Process control
Use of temperature profiles via PC software
Support
Tailored mask design

MINIOVEN 05

The MINIOVEN 05 is a compact and robust table-top device specially designed for reballing of BGAs and prebumping of QFN components. The device is used in development and production. The efficient hybrid heating technology heats up electronic components evenly from all sides and thereby guarantees reproducible reballing results. Up to 25 heating profiles can be set up, administered and saved through the intuitive menu navigation.An additional external temperature sensor is used to ensure the highest possible reliability as the device automatically adjusts the reballing profiles. Through the sensor, the optimal profile settings for achieving the specified component temperatures are determined through the sensor. The EASYBEAM software allows for the convenient editing of reballing profiles as well as for the temperature history to be depicted. Aside from the reballing process for BGA components, there are also images and provisions available for the prebumping of QFN components. The device possesses a connection for process gas. This allows the reflow processes to be easily converted to nitrogen-based atmospheres.

Product variations in the shop

HB00.0025
MINIOVEN 05, 230 V

Basic Unit for Reballing and QFN Prebumping
incl. Basic Equipment

Article Nr.: HB00.0025
HB00.0027
MINIOVEN 05, 115 V

Basic Unit for Reballing and QFN Prebumping
incl. Basic Equipment

Article Nr.: HB00.0027

Standard equipment

  • MINIOVEN 05 Base Unit
  • Sensor for temperature (K-Type)
  • Cutter knife
  • SMD hook
  • Cleaning pen with three spare inserts
  • Capton tape
  • Magnifier
  • Power cable
  • Manual

Technical details

Power consumption:550 VA
Power heating system:500 W4 x IR-lamps
Size heating system:105 x 130 mm2
Number of temperature sensors:1 x internally inst. & 1 x external opt.
Number of profiles:25 memory slots
Max. component size:55 x 55 x 4 mm3
 
Mains:1 Phase, 230 VAC
Dimensions:150 x 300 x 85 mm3
Weight:800 g

Downloads

Optional extras

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HB00.4005
Process Gas Connection Set

for MO 05

Article Nr.: HB00.4005
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HB00.0112
Switch Box Process Gas

for MINIOVEN 05 with connection set

Article Nr.: HB00.0112
VD90.5104
Solder balls, 250µm (=3g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free CSP

Article Nr.: VD90.5104
VD90.5101
Solder balls, 762µm (=86g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free BGA

Article Nr.: VD90.5101
HT00.0009
Flux Pen lead-free

0405 C, no clean, REL0

Article Nr.: HT00.0009
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