Compact hybrid reflow oven
For reball and reflow processes on BGA, CSP and QFN components at the best temperature distribution.
Products in shop

Top FeaturesHybrid heating technology for the best temperature distribution

Process reliability
Optimized heat distribution via convection
Reflow of solder paste or solder balls
Plug and Play
Compact format, innovative design and intuitive operation
Nitrogen connection for optimal reflow of solder balls
Process control
Use of temperature profiles via PC software
Tailored mask design


The MINIOVEN 05 is a compact and robust table-top device specially designed for reballing of BGAs and prebumping of QFN components. The device is used in development and production. The efficient hybrid heating technology heats up electronic components evenly from all sides and thereby guarantees reproducible reballing results. Up to 25 heating profiles can be set up, administered and saved through the intuitive menu navigation. An additional external temperature sensor is used to ensure the highest possible reliability as the device automatically adjusts the reballing profiles. Through the sensor, the optimal profile settings for achieving the specified component temperatures are determined through the sensor. The EASYBEAM software allows for the convenient editing of reballing profiles as well as for the temperature history to be depicted. Aside from the reballing process for BGA components, there are also images and provisions available for the prebumping of QFN components. The device possesses a connection for process gas. This allows the reflow processes to be easily converted to nitrogen-based atmospheres.

Product variations in the shop

MINIOVEN 05, 230 V

Basic Unit for Reballing and QFN Prebumping
incl. Basic Equipment

Article Nr.: HB00.0025
MINIOVEN 05, 115 V

Basic Unit for Reballing and QFN Prebumping
incl. Basic Equipment

Article Nr.: HB00.0027

Standard equipment

  • MINIOVEN 05 Base Unit
  • Sensor for temperature (K-Type)
  • Cutter knife
  • SMD hook
  • Cleaning pen with three spare inserts
  • Capton tape
  • Magnifier
  • Power cable
  • Manual


Reballing with the Minioven cuts cost and lead time by not outsourcing the product.

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The Minioven offers a compact, fast, simple and economical solution for pre-bumping of QFNs.

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Technical details

Power consumption: 550 VA
Power heating system: 500 W 4 x IR-lamps
Size heating system: 105 x 130 mm2
Temperature range: 50 °C - 250 °C
Number of temperature sensors: 1 x internally inst. & 1 x external opt.
Number of profiles: 25 memory slots
Max. component size: 55 x 55 x 4 mm3
Mains: 1 Phase, 230 VAC
Dimensions: 150 x 300 x 85 mm3
Weight: 800 g

Optional extras

Basic Equipment for MINIOVEN 04/05 Set

clean pen,hook,tape,cutter,magnifier

Article Nr.: HB50.0004
Process Gas Connection Set

for Minioven 05

Article Nr.: HB00.4005
Switch Box Process Gas

for Minioven 05 with connection set

Article Nr.: HB00.0112
Solder balls, 200µm (=1,4g), 50,000 pc

Sn63Pb37, CSP

Article Nr.: VD90.5003
Solder balls, 250µm (= 3,5g), 50,000 pc

Sn63Pb37, CSP

Article Nr.: VD90.5004
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