ReworkPerfect solutions for the entire range of applications.

Martin offers specialized equipment for the entire range of qualifiable rework processes. The devices in the EXPERT series are equipped with intuitive and touch-enabled EASYSOLDER07 software. Components between 0.5mmx0.25mm (0402) and 75mmx75mm can be desoldered, placed and soldered at an accuracy of within 15μm. With the help of App Tools and the MINIOVEN 05, it is possible to prepare various component shapes for the process. Precise soldering profiles by reflow heating technology are our core competence. In combination with the devices of the Dispense series, we create a perfect environment for your projects. The camera-supported devices offer the unbeatable advantage of being able to monitor the entire process. Our unique positioning technology enables fast and extremely precise detailed work. With our stations, we guarantee perfect solutions, resource-conserving processes and reproducible results.

DevicesOur Rework devices.

Semiautomatic 5300 W hybrid Rework station for repairing large circuit boards, such as server- or mainboards.

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Semiautomatic 3,300 W hybrid Rework station for repairing BGA, CSP and QFP components on medium-sized circuit boards.

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Semiautomatic hybrid Rework station with adjustable 410 W heating system for the repair of small circuit boards, such as those found in smartphones.

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Software-controlled Rework station with camera for repairing medium-sized to small circuit boards.

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Manual 2,300 W software-controlled Rework station for repairing medium-sized to small circuit boards.

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Combination of a 480 W hot-gas source with a vacuum pen for manual reworking of circuit boards.

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High-performance 2,000 W IR under-heating system for manual soldering work for or preheating of medium-sized circuit boards.

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Compact 500 W IR under-heating system perfectly suitable for preheating and handling small circuit boards.

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Efficient 700 W contact-heat under heater for reworking small circuit boards and components.

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Compact hybrid device for reball and reflow processes on BGA, CSP and QFN components at the best temperature distribution.

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TechnologiesOur Rework technologies for optimal results.

AVP stands for Advanced Vision Placement and achieves software supported, application independent placement of components.  This means:



  • No adjustment of the camera lens,

  • No alignment of respective camera images

  • Users merely mark the corners of the component with the ...
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Typical faults in electronic assemblies are micro cracks inside interconnects of BGA solder joints. They lead to malfunction of the assembly even so that the BGA chip is full in function. 


De-soldering and cleaning of residual solder from PCB and BGA, re-balling of the chip and ...

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Because of the very small amounts of solder on the contacts of QFNs the use of residual solder in rework is not recommended.  It is imperative that the pads of the board are cleaned; normally there is no possibility of applying new solder to them.  One way of providing solder to the ...

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SoftwareSoftware as a carrier of innovation.

The software EASYSOLDER 07 guides the user through the entire rework process with clarity. The “AutoProfiler” is a special simplification. Using a few datapoints and the measured values of several temperature sensors, the software module creates a soldering and desoldering ...

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VideosProduct- und application videos.

EXPERT 05.6 IXH Rework Station

With the EXPERT 05.6 IXH rework station, which contains an integrated camera positioning system, MARTIN offers a cost-effective solution for the complete rework process. With the integrated camera even the smallest components can be manually placed and repaired ...

Board cleaning SMART DESOLDER & HOTBEAM 04

The SMART DESOLDER combines a manual hot gas source with a vacuum pen for extraction of residual solder. Damage to the pads from overheating or mechanical stress is avoided through targeted heating of the residual solder after lifting the component. The ...

Multichip Desolder EXPERT 10.6

The EXPERT 10.6 HV and HXV are perfect solutions for desoldering multiple components in one step. With this opportunity a tremendous amount of time can be saved. With less heating cycles the lifetime of the PCB is additionally increased. Martin offers various kind ...

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