Pre-bumping Application with the MINIOVEN 05

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The Minioven offers a compact, fast, simple and economical solution for pre-bumping of QFNs.

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The semi-automatic Rework station with hot gas facilitates the reliable and precise rework of BGA, CSP, and QFN components, connectors, sockets, micro SMDs and more.

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With the manual Rework station Expert 05.6 IXH, MARTIN offers a cost-effective solution for the complete rework process, from desoldering, pad cleaning, positioning to soldering.

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Reballing with the Minioven cuts cost and lead time by not outsourcing the product.

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