Videos

The semi-automatic Rework station with hot gas facilitates the reliable and precise rework of BGA, CSP, and QFN components, connectors, sockets, micro SMDs and more.

With the manual Rework station Expert 05.6 IXH, MARTIN offers a cost-effective solution for the complete rework process, from desoldering, pad cleaning, positioning to soldering.

Reballing with the Minioven cuts cost and lead time by not outsourcing the product.

The Minioven offers a compact, fast, simple and economical solution for pre-bumping of QFNs.

With the combination of SMART DESOLDER 01 and HOTBEAM, residual solder can be removed simply and contactless.

Chip Underfill on a Puma pick-and-place machine with integrated dispensing
Essemtec AG, Aesch/LU, Switzerland

The EXPERT 10.6 HV and HXV are perfect solutions for desoldering multiple components in one step. With this opportunity a tremendous amount of time can be saved.

The Printer Tool on the Expert 10.6 rework system allows solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing ...

For Extensive Tasks: EXPERT 10.6 The rework station family EXPERT 10.6 has been developed for the reliable and precise rework of SMDs, sockets and connectors. Innovative technologies, such as Advanced Vision Placement (AVP), ...

BGA Flux Dipping on Martin Expert 10.6 rework system. Allows solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste.

27mm BGA repair on an rework station using IR / convection heating technologies for unmatched temperature uniformity.

Preparing the PCB surface for the soldering process with accurate residual solder removal using the combination of a hot-gas source with a vacuum pen.