EXPERT 10.6 HXV

5300 W Rework station
Semiautomatic hybrid Rework station for repairing large circuit boards, such as server- or mainboards.
Products in shop
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Top FeaturesCamera-supported rework

Flexibility
Various PCB sizes and shapes as well as components available up to 75 x 75 mm2
Under-heating system
Large PCBs 500 x 500 mm2
Performance
Uniform heat distribution through convection and hybrid technology
Multifunctionality
One device for all processes, including desoldering, pad cleaning, automatic positioning and soldering
Process control
Automatic profiler for under- and top-heating systems
Software
Simple, intuitive, tablet-compatible

EXPERT 10.6 HXV

Rework Station with 5,300 W hybrid under-heating system. The heating area of 450 x 420 mm2 is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER 07 software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).

This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.

Product variations in the shop

DB00.1066
EXPERT 10.6 HXV

Hybrid rework station 5300W, autom. placement

Article Nr.: DB00.1066

Standard equipment

  • Tool set for dispensing, placing, residual solder removal and soldering with magazine
  • Set of placement nozzles XL-type (BGA/CSP) 5 mm, 8 mm, 15 mm with O-Ring
  • Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
  • Two camera lenses (BGA und CSP)
  • Two thermocouple sensors (type K)
  • Six PCB magnet holder 40,5 mm (3x standard, 3x Easy Lock)
  • Three PCB clips to install at hand rest
  • Foot switch
  • Manual
  • Intuitive software EASYSOLDER 07 with touch integration

Components

  • LED rework
  • Sockets
  • Connectors
  • Daughter boards
  • Interposer boards
  • Sub assemblies
  • RF frames
  • RF shields
  • Rework on flex
  • Small passives down to 0402
  • SON
  • PGA
  • QFP
  • PoP
  • DFN
  • QFN
  • µBGA/CSP
  • BGA
  • BGA up to 75x75mm
  • Underfiller or coated components
  • Film capacitor

Processes

  • Dipping
  • Paste printing
  • Solder removal
  • Soldering
  • Desoldering
  • Reballing
  • Dispensing
  • Multichip soldering

Technical details

Power consumption: 5,500 VA
Power solder pen: 300 W, 35 l/min
Power under-heating system: 1200 - 5000 W 8 x IR-lamps
Size under-heating system: 450 x 420 mm2
Max. PCB size: 480 x 480 mm2
Resolution motion system: 0,001 mm
 
Placement accuracy: ± 0,015 mm (Flip Chip)*
± 0,030 mm (CSP)
± 0,040 mm (BGA)
± 0,070 mm (Maxi BGA)*

± 0,115mm

(Maxi BGA XL)*

High resolution CMOS-camera: 5 Mio. Pixel USB2
Camera field of view (FOV): 16 x 22 mm2 (Flip Chip)*
32 x 42 mm2 (CSP)
42 x 57 mm2 (BGA)
71 x 96 mm2 (Maxi BGA)*

115 x 160mm²

(Maxi BGA XL)*

Mains: 1Phase, 230VAC, fused 16A Stecker Typ CEE 32A (3-phasig)
Pressurized air: 5-8 bar, 100 l/min, clean, dry air
Dimensions: 1030 x 630 mm2
* Optional extras

Downloads

Optional extras

SF66.0501
Tool Shuttle 40mm

for AVP 4.1XL

Article Nr.: SF66.0501
SF64.0525
Dip Tool 0.08mm with squeegee

for tool shuttle 32 / 40mm

Article Nr.: SF64.0525
SF64.0526
Dip Tool 0.15mm with squeegee

for tool shuttle 32 / 40mm

Article Nr.: SF64.0526
SF64.0527
Dip Tool 0.22mm with squeegee

for tool slider 32 / 40mm

Article Nr.: SF64.0527
SF66.0526
Dip Tool 0.15mm with squeegee

for tool shuttle 40mm

Article Nr.: SF66.0526
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