EXPERT 10.6 HXV
Semiautomatic hybrid Rework station for repairing large circuit boards, such as server- or mainboards.
Top FeaturesCamera-supported rework
EXPERT 10.6 HXV
Rework Station with 5,300 W hybrid under-heating system. The heating area of 450 x 420 mm2 is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER 07 software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K).
This system is particularly suitable for large size PCBs like PCs, Laptops and Server Boards with small up to very big components.
Product variations in the shop
 | DB00.1066 | EXPERT 10.6 HXV Hybrid rework station 5300W, autom. placement Article Nr.: DB00.1066 |
Standard equipment
- Tool set for dispensing, placing, residual solder removal and soldering with magazine
- Set of placement nozzles XL-type (BGA/CSP) 5 mm, 8 mm, 15 mm with O-Ring
- Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
- Two camera lenses (BGA und CSP)
- Two thermocouple sensors (type K)
- Four PCB magnet holder 40,5 mm (standard)
- Three PCB clips to install at hand rest
- Foot switch
- Manual
- Intuitive software EASYSOLDER 07 with touch integration
Components
- LED rework
- Daughter boards
- Interposer boards
- Sub assemblies
- RF frames
- RF shields
- Rework on flex
- Small passives down to 0402
- SON
- PGA
- LGA
- QFP
- PoP
- DFN
- QFN
- µBGA/CSP
- BGA up to 67x67mm
- Sockets
- Connectors
- CPU
- Underfiller or coated components
- Film capacitor
Processes
- Dipping
- Paste printing
- Solder removal
- Soldering
- Desoldering
- Reballing
- Dispensing
- Multichip soldering
Videos
The semi-automatic Rework station with hot gas facilitates the reliable and precise rework of BGA, CSP, and QFN components, connectors, sockets, micro SMDs and more.
The EXPERT 10.6 HV and HXV are perfect solutions for desoldering multiple components in one step. With this opportunity a tremendous amount of time can be saved.
The Printer Tool on the Expert 10.6 rework system allows solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing ...
Technical details
| Power consumption: | 5,500 VA | |||||||||||||||||||||||||||||||
| Power solder pen: | 300 W, 35 l/min | |||||||||||||||||||||||||||||||
| Power under-heating system: | 1200 - 5000 W | 8 x IR-lamps | ||||||||||||||||||||||||||||||
| Size under-heating system: | 450 x 420 mm2 | |||||||||||||||||||||||||||||||
| Max. PCB size: | 480 x 480 mm2 | |||||||||||||||||||||||||||||||
| Resolution motion system: | 0,001 mm | |||||||||||||||||||||||||||||||
| Placement accuracy: | ± 0,015 mm | (Flip Chip)* | ||||||||||||||||||||||||||||||
| ± 0,030 mm | (CSP) | |||||||||||||||||||||||||||||||
| ± 0,040 mm | (BGA) | |||||||||||||||||||||||||||||||
| ± 0,070 mm | (Maxi BGA)* | |||||||||||||||||||||||||||||||
| ± 0,115mm | (Maxi BGA XL)* | |||||||||||||||||||||||||||||||
| High resolution CMOS-camera: | 5 Mio. Pixel USB2 | |||||||||||||||||||||||||||||||
| Size of components: |
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| Mains: | 1Phase, 230VAC, fused 25A | Connector Type CEE 32A (3 phase) | ||||||||||||||||||||||||||||||
| Pressurized air: | 5-8 bar, 100 l/min | clean, dry air | ||||||||||||||||||||||||||||||
| Dimensions: | 1030 x 630 mm2 | |||||||||||||||||||||||||||||||
| Weight: | 96 kg | |||||||||||||||||||||||||||||||
| * Optional extras |
Downloads
| Product flyer | 0.9 MB | Download |
Optional extras
 | SF66.0501 | Tool Slider 40mm for AVP 4.1XL Article Nr.: SF66.0501
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 | SF64.0525 | Dip Tool 0.08mm with squeegee for tool shuttle 32 / 40mm Article Nr.: SF64.0525
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| SF64.0526 | Dip Tool 0.15mm with squeegee for tool shuttle 32 / 40mm Article Nr.: SF64.0526
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 | SF64.0527 | Dip Tool 0.22mm with squeegee for tool slider 32 / 40mm Article Nr.: SF64.0527
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| SF66.0526 | Dip Tool 0.15mm with squeegee for tool shuttle 40mm Article Nr.: SF66.0526
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