EXPERT 10.6 HV

3,300 W Rework station
Semiautomatic hybrid Rework station for repairing BGA, CSP and QFP components on medium-sized circuit boards.
Products in shop
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Top FeaturesCamera-supported rework

Flexibility
Various PCB sizes and shapes as well as components available
Under-heating system
Highest energy density for thermally demanding boards.
Performance
Uniform heat distribution through convection and hybrid technology
Multifunctionality
One device for all processes, including desoldering, pad cleaning, automatic positioning and soldering
Software
Simple, intuitive, tablet-compatible
Precision
Precision of placement within 15 µm

EXPERT 10.6 HV

Rework Station with 3,300W hybrid under heater. The heating area of 275 x 245 mm² is adjustable to PCB size. Automated SMD placement process by Auto Vision Placer (AVP) incl. EASYSOLDER software package and DBL 06 control unit with six high resolution sensors inputs for thermocouples (Type K). This system is particularly suitable for mid-size and large PCBs with fine-pitch components of varying package dimensions.

Product variations in the shop

DB00.1065
EXPERT 10.6 HV

Hybrid rework station, 3300W, autom. placement

Article Nr.: DB00.1065

Standard equipment

  • Tool set for dispensing, placing, residual solder removal and soldering with magazine
  • Set of placement nozzles (BGA/CSP) 3 mm, 5 mm, 8 mm, 10 mm
  • Set of solder nozzles (BGA) 15 mm, 27 mm, 35 mm, 40 mm
  • Two camera lenses (BGA und CSP)
  • Two thermocouple sensors (type K)
  • Four PCB magnet holder 40,5 mm (standard)
  • Two PCB clips to install at hand rest
  • Foot switch
  • Rework ABC and manual
  • Intuitive software EASYSOLDER 07 with touch integration

Technical details

Power consumption:3,500 VA
Power solder pen:300 W, 35 l/min
Power under-heating system:600-3,000 W6 x IR-lamps
Size under-heating system:275 x 245 mm²
Max. PCB size:305 x 305 mm²
Resolution motion system:0,001 mm
 
Placement accuracy:± 0,015 mm(Flip Chip)*
± 0,030 mm(CSP)
± 0,040 mm(BGA)
± 0,070 mm(Maxi BGA)*
± 0,115 mm

 (Maxi BGA XL)*

 
High resolution CMOS-camera:5 Mio. Pixel,USB2
Camera field of view (FOV):14 x 18 mm²(Flip Chip)*
28 x 37 mm²(CSP)
37 x 50 mm²(BGA)
65 x 85 mm²(Maxi BGA)*

115 x 160mm²

(Maxi BGA XL)*

 
Mains:1Phase, 230VAC, Fuse 16AConnector Type CEE 32A (3 phase)
Pressurized air:5-8 bar, 100 l/minclean, dry air
Dimensions:865 x 460 mm²
 
* Optional extras

Downloads

Optional extras

SF64.0501
Tool Shuttle 32mm

for AVP 4.1

Article Nr.: SF64.0501
SF64.0525
Dip Tool 0.08mm with squeegee

for tool shuttle 32 / 40mm

Article Nr.: SF64.0525
SF64.0526
Dip Tool 0.15mm with squeegee

for tool shuttle 32 / 40mm

Article Nr.: SF64.0526
SF64.0527
Dip Tool 0.22mm with squeegee

for tool slider 32 / 40mm

Article Nr.: SF64.0527
SF64.0520
Print Tool with squeegee

for tool shuttle 32 / 40mm

Article Nr.: SF64.0520
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