Minioven-05-Perspektive01

MINIOVEN 05, 115 V

Basic Unit for Reballing and QFN Prebumping
incl. Basic Equipment

Article Nr. Description Amount Price Remember
HB00.0027
MINIOVEN 05, 115 V

Basic Unit for Reballing and QFN Prebumping
incl. Basic Equipment

Article Nr.: HB00.0027

Variations

HB00.0025
MINIOVEN 05, 230 V

Basic Unit for Reballing and QFN Prebumping
incl. Basic Equipment

Article Nr.: HB00.0025

Optional extrasMINIOVEN 05, 115 V

REWORK optional extras

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HB50.0004
Basic Equipment for MINIOVEN 04/05 Set

clean pen,hook,tape,cutter,magnifier

Article Nr.: HB50.0004
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HB00.4005
Process Gas Connection Set

for MO 05

Article Nr.: HB00.4005
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HB00.0112
Switch Box Process Gas

for MINIOVEN 05 with connection set

Article Nr.: HB00.0112
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Solder balls

VD90.5003
Solder balls, 200µm (=1,4g), 50,000 pc

Sn63Pb37, CSP

Article Nr.: VD90.5003
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VD90.5004
Solder balls, 250µm (= 3,5g), 50,000 pc

Sn63Pb37, CSP

Article Nr.: VD90.5004
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VD90.5005
Solder balls, 300µm (= 6g), 50,000 pc

Sn63Pb37, CSP

Article Nr.: VD90.5005
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VD90.5008
Solder balls, 400µm (= 14g), 50,000 pc

Sn63Pb37, CSP

Article Nr.: VD90.5008
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VD90.5208
Solder balls, 400µm (= 70g), 250,000 pc

Sn63Pb37, CSP

Article Nr.: VD90.5208
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VD90.5010
Solder balls, 450µm (= 20g), 50,000 pc

Sn63Pb37, CSP

Article Nr.: VD90.5010
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VD90.5009
Solder balls, 500µm (= 27g), 50,000 pc

Sn63Pb37, CSP

Article Nr.: VD90.5009
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VD90.5006
Solder balls, 600µm (= 47g), 50,000 pc

Sn63Pb37, BGA

Article Nr.: VD90.5006
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VD90.5001
Solder balls, 762µm (= 96g), 50,000 pc

Sn63Pb37, BGA

Article Nr.: VD90.5001
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VD90.5103
Solder balls, 200µm (=3g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free CSP

Article Nr.: VD90.5103
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VD90.5104
Solder balls, 250µm (=3g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free CSP

Article Nr.: VD90.5104
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VD90.5105
Solder balls, 300µm (=5.2g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free CSP

Article Nr.: VD90.5105
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VD90.5115
Solder balls, 350µm (=7.5g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free CSP

Article Nr.: VD90.5115
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VD90.5108
Solder balls, 400µm (=12.5g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free CSP

Article Nr.: VD90.5108
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VD90.5110
Solder balls, 450µm (=18g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free CSP

Article Nr.: VD90.5110
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VD90.5109
Solder balls, 500µm (=24g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free CSP

Article Nr.: VD90.5109
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VD90.5106
Solder balls, 600µm (=42g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free BGA

Article Nr.: VD90.5106
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VD90.5101
Solder balls, 762µm (=86g), 50,000 pc

Sn96.5Ag3Cu0.5, lead-free BGA

Article Nr.: VD90.5101
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Flux/Adhesives

HT00.0009
Flux Pen lead-free

0405 C, no clean, REL0

Article Nr.: HT00.0009
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Spare and ware parts – Rework Technology

HT00.0013
Sensor for temperature

for HTM/DBL/HA/HB/IRF, type K,2 pin,1.3 m

Article Nr.: HT00.0013
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Masks & Frames

LW00.0040
New frame CSP ??*??mm

for minioven fixture / printer / 27*27mm

Article Nr.: LW00.0040
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LW00.0002
New prebumping mask & frame QFN ??*??mm

n=? / pitch=? / pads=(?+?)?

Article Nr.: LW00.0002
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LW00.0045
New Reballing frame BGA ??*??mm eco

for minioven fixture 45*45/ 64*64mm

Article Nr.: LW00.0045
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LW00.0029
New Reballing mask BGA 45*45/64*64mm

n=? / pitch=? / grid=??*?? / ball=?

Article Nr.: LW00.0029
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LW00.0001
New Reballing mask CSP

n=max1000 / pitch=? / grid=??*?? / ball=?

Article Nr.: LW00.0001
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Sets

LW50.9001
Reballing 04/05 set eco standard

Reballing Fixture BGA 45*45mm
Reballing frame set BGA eco 7 pieces
(15, 23, 27, 31, 35, 37.5, 40)
4 Reballing masks BGA 45*45mm:
Mask BGA n=961 / pitch=1.27 / grid=31*31 / ball=0.762
Mask BGA n=900 / pitch=1.27 / grid=30*30 / ball=0.762
Mask BGA n=1369 / pitch=1.00 / grid=37*37 / ball=0.60
Mask BGA n=1296 / pitch=1.00 / grid=36*36 / ball=0.60

Article Nr.: LW50.9001
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LW50.9004
Reballing set eco Finepitch

Reballing Fixture BGA 45*45mm
Reballing frame set BGA eco 7 pieces
(15, 23, 27, 31, 35, 37.5, 40)
4 Reballing masks BGA 45*45mm:
Mask BGA n=1849 / pitch=0.80 / grid=43*43 / ball=0.50
Mask BGA n=1764 / pitch=0.80 / grid=42*42 / ball=0.50
Mask BGA n=1369 / pitch=1.00 / grid=37*37 / ball=0.60
Mask BGA n=1296 / pitch=1.00 / grid=36*36 / ball=0.60

Article Nr.: LW50.9004
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LW50.9003
Reballing set PS 04

(Processor PS 4 and PS 4 Pro)
Reballing fixture BGA 64*64mm
Reballing frame BGA 40*40mm
Reballing frame BGA 42*42mm
2 Reballing masks BGA

Article Nr.: LW50.9003
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SF29.0002
Prebumping 05 set QFN

Printer, holder, squeegee, tweezers, new prebumping mask

Article Nr.: SF29.0002
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LW40.0500
Reballing frame set BGA eco

7 pieces (15, 23, 27, 31, 35, 37.5, 40)

Article Nr.: LW40.0500
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Reballing & Prebumping fixtures

LW40.0252
Prebump fixture with printer QFN 27*27mm

for MO 04/05

Article Nr.: LW40.0252
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LW40.0236
Reballing Fixture BGA 45*45mm

for MO 04/05, 4 downholder clips

Article Nr.: LW40.0236
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LW40.0237
Reballing Fixture BGA 45*45mm

for MO 04/05, 4 clips and support grid (to be used for PS3)

Article Nr.: LW40.0237
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LW40.0239
Reballing fixture BGA 64*64mm

for MO 04/05, 4 downholder clips

Article Nr.: LW40.0239
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LW40.0240
Reballing fixture BGA 64*64mm + support grid

for MO 04/05, 4 downholder clips

Article Nr.: LW40.0240
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LW40.0251
Reballing fixture CSP 27*27mm

for MO 04/05 Standard

Article Nr.: LW40.0251
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