Board cleaning SMART DESOLDER & HOTBEAM 04

The SMART DESOLDER combines a manual hot gas source with a vacuum pen for extraction of residual solder. Damage to the pads from overheating or mechanical stress is avoided through targeted heating of the residual solder after lifting the component. The temperature-controlled airflow prevents the neighboring components from warming up. After melting, the residual solder is removed contactless by the vacuum pen. The use of a Teflon tip in the vacuum pen offers outstanding features: the nonstick effect, the temperature-resistance and the mechanically soft surface of the material. The combination with HOTBEAM 04/05 significantly improves the process. Removal of residual solder can be solved precisely and safely with the two devices.

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Application of Delo Photobond DM4083
Industrial research, project no. 19390N „Fadenfrei“
Institute of Joining and Welding,
Technical University Braunschweig

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The semi-automatic Rework station facilitates the reliable and precise rework of BGA, CSP, and QFN components, connectors, sockets, micro SMDs and more.

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With the manual Rework station Expert 05.6 IXH, MARTIN offers a cost-effective solution for the complete rework process, from desoldering, pad cleaning, positioning to soldering.

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