Chip Underfill with the HOTBEAM 04

Chip Underfill on a Puma pick-and-place machine with integrated dispensing
Essemtec AG, Aesch/LU, Switzerland

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Application of Delo Photobond DM4083
Industrial research, project no. 19390N „Fadenfrei“
Institute of Joining and Welding,
Technical University Braunschweig

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The semi-automatic Rework station with hot gas facilitates the reliable and precise rework of BGA, CSP, and QFN components, connectors, sockets, micro SMDs and more.

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With the manual Rework station Expert 05.6 IXH, MARTIN offers a cost-effective solution for the complete rework process, from desoldering, pad cleaning, positioning to soldering.

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