Videos

MARTIN bietet mit der REWORK Station EXPERT 05.6 IXH, die ein integriertes Kamera Positionierungssystem enthält, eine kostengünstige Lösung für den gesamten REWORK Prozess. Mit der integrierten Kamera können auch kleinste Bauteile mit hoher Präzision manuell ...

The SMART DESOLDER combines a manual hot gas source with a vacuum pen for extraction of residual solder. Damage to the pads from overheating or mechanical stress is avoided through targeted heating of the residual solder after lifting the component. The ...

The EXPERT 10.6 HV and HXV are perfect solutions for desoldering multiple components in one step. With this opportunity a tremendous amount of time can be saved. With less heating cycles the lifetime of the PCB is additionally increased. Martin offers various kind ...

The Martin Expert 10.6 rework station facilitates the reliable and precise rework of BGA, CSP, and QFN components, connectors, sockets, micro SMDs and more. Innovative technologies such as "Advanced Vision Placement", hybrid heating ...

Rework demo showing: - thermocouples for real time temperature feedback - solder flux application - top heater (convection) and bottom heater (infrared) - Easy Solder rework software - reflow process - successul desoldering and removal

Reballing and Prebumping With the Reballing- and Prebumping-Sets for the MINIOVEN rework turns into a success story. Whether applying solder to small QFNs or Reballing especially large BGAs, the MINIOVEN is well suited to almost any task, thanks to the ...

The Printer Tool on the Expert 10.6 rework system allows solder paste or flux to be printed directly onto small components such as quad flat no-leads, enabling immediate placement onto a printed circuit board. Printing ...

For Extensive Tasks: EXPERT 10.6 The rework station family EXPERT 10.6 has been developed for the reliable and precise rework of SMDs, sockets and connectors. Innovative technologies, such as Advanced Vision Placement (AVP), ...

BGA Flux Dipping on Martin Expert 10.6 rework system. Allows solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste.

27mm BGA repair on an rework station using IR / convection heating technologies for unmatched temperature uniformity.

System for gaming console, PS3, xbox repair/rework - precise temperature control using a hybrid underboard heater, IR, and hot air convection.

Accurate residual solder removal (also known as site dressing) is an important factor in the success of most rework applications. The video shows how the Martin hot air pen and teflon tipped suction tool (teflon will not damage the pads) work together to easily ...