Spinner
 

MINIOVEN 04

Desk Top Reflow Oven

The MINIOVEN 04 provides a fully-fledged reflow environment in a very compact form.  This tabletop equipment is ideal for Pre-Bumping of QFNs and also for Reballing of BGAs and CSPs.

Perfect temperature management is foremost.  The efficient hot gas circulation ensures optimal heating of the component and a controlled reflow process.  For especially stringent demands for the highest soldering quality the MINIOVEN is also available with a gas connection for processing gases, such as nitrogen, argon and formic.

The MINIOVEN is controlled via an intuitive menu from the display.  Up to 99 profiles, through the system software component specifically adjusted, can be stored.  In addition to this tabletop oven MARTIN offer an extensive range stock stencils; bespoke versions can be realised at short notice.

MINIOVEN 04 S/N

 

MINIOVEN 04S

 

Very compact table top reflow oven to reball or pre-bump BGA, CSP or QFN comonents. Combined IR and convection heating technology achieves controlled reflow of solder material (spheres and paste). 

Heater (IR):500 W
Component size (max):60 mm x 60 mm
Foot print:150 mm x 300 mm
Proces gas inlet:no

MINIOVEN 04N

Very compact table top reflow oven to reball or pre-bump BGA, CSP or QFN comonents under process gas athmosphere. Combined IR and convection heating technology achieves controlled reflow of solder material (spheres and paste). 

Heater (IR):500 W
Component size (max):60 mm x 60 mm
Foot print:150 mm x 300 mm
Proces gas inlet:yes

  • MINIOVEN 04S

    The table top reflow oven

  • MINIOVEN 04N

    The Reflowofen with Process Gas

More Information

Application

The typical application is the reballing of BGA and CSP components. This alwyas is required when the comonent is desoldered from the board and has to be preparred for soldering in a standard rework process.

Very common is the pre-pumping of QFN, too. They come without any solder depot from chip supplier and have to be preparred for rework first. Tools, paste and equipment are available to add solder to the contact pads of QFN. The MINOVEN 04 device is processing the controlled reflow.

BGA Reballing

  • Pour Solder Balls on Stencil
  • Remove Stencil from Reballing Fixture
  • Readily reballed BGA

A typical fault in the interconnection of BGAs is poor wetting of the pads.  The application of new solder spheres can restore functional BGAs to full usability. The components are inserted into a special reballing frame.  A stencil with holes corresponding to the contact pads of the BGA is placed onto the component and the solder balls poured into the apertures until all spaces are filled.  Finally, the controlled and gentle reflow process in the MINIOVEN 04 completes the procedure.

MARTIN offer a very large selection of stencils for different BGAs, CSPs, etc. from stock.  It is also often possible to adapt standard stencils by the use of Kapton tape.
Standard sizes of the frames and stencils cover components from 18x18mm to 52x52mm.  For smaller CSPs specifically designed tools can be made available.  Detailed information is obtainable from your local representative.

Pre-Bumping

  • Pre-Bumping Set incl. QFN w/o Solder Paste
  • Solder Paste with Squeeze
  • QFN with Solder Depots after Process

Because of the very small amounts of solder on the contacts of QFNs the use of residual solder in rework is not recommended.  It is imperative that the pads of the board are cleaned; normally there is no possibility of applying new solder to them.  One way of providing solder to the joints is to add it to the pads of the components. The QFNs are then reflowed to ensure that the small solder volumes are firmly attached.
The Pre Bumping process can be carried out easily with specific tools, specially developed for use with the MINIOVEN 04 and are available from stock for a very wide range of types of QFNs.
MARTIN can supply special stencils, the necessary solder pastes as well as other tooling.  Detailed information is obtainable from your local representative.

Options and Accessories

  • Reball-04 Set Standard
  • Prebump-04 Set QFN
  • Reball-04 Set PS3

Product Brochure

REWORK_ENG_04.pdf Product Broschure REWORK Technology 791 KB