AVP Positioning Technology

AVP stands for Advanced Vision Placement and achieves software supported, application independent placement of components.  

  • No adjustment of the camera lens,
  • No alignment of respective camera images
  • Users merely mark the corners of the component with the mouse on the monitor image and the system takes over the automatic alignment and placement of the component
  • Components are accurately placed on the PCB
  • Simple automatic calibration

The patented process reduces placement errors to a minimum as the component is aligned by the high-resolution colour camera while suspended a very short distance above the board.
For the different component size ranges (µSMD->BGA or 0402 to 48 x 48 mm²) three lenses with fixed magnifications are available.

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Manual camera-supported adjustment and placement of components via the MCP positioning arm. Precisely aligned to the pad structures of the PCB, it is accomplished in a user-friendly and reliable way.

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The pre-bumping process can be easily and safely performed with MARTIN's pre-bumping tools. These have been specially developed for use with the MINIOVEN.

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Reballing with the Minioven cuts cost and lead time by not outsourcing the product.

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