MARTIN’s Desoldering Tools

Wessling, November 2011.
With combined soldering and pick up tooling for the MARTIN EXPERT series QFN components can be desoldered and safely lifted off the boards.

The challenge in reworking these components lies with the direct thermal link between Exposed Pads and the Ground Plane of printed circuit boards.  This has the effect of the components to be reworked cooling so quickly that in any, even short pause between heating and lifting the solder solidifies. 

MARTIN’s new combined Soldering-Pickup-Tooling addresses this problem by switching on the vaccum as soon as the heating phase is complete. The component is lifted immediately, thus ensuring that no damage to components or printed circuit boards occurs. 




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