BGA Flux Dipping on Martin Expert 10.6 rework system. Allows solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste.
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Application of Delo Photobond DM4083
Industrial research, project no. 19390N „Fadenfrei“
Institute of Joining and Welding,
Technical University Braunschweig
The semi-automatic Rework station with hot gas facilitates the reliable and precise rework of BGA, CSP, and QFN components, connectors, sockets, micro SMDs and more.
With the manual Rework station Expert 05.6 IXH, MARTIN offers a cost-effective solution for the complete rework process, from desoldering, pad cleaning, positioning to soldering.
