Flux dipping tool for SMT rework

BGA Flux Dipping on Martin Expert 10.6 rework system. Allows solder spheres on the underside of an area-array device to be coated with a controlled, defined volume of flux or solder paste.

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Application of Delo Photobond DM4083
Industrial research, project no. 19390N „Fadenfrei“
Institute of Joining and Welding,
Technical University Braunschweig

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The semi-automatic Rework station facilitates the reliable and precise rework of BGA, CSP, and QFN components, connectors, sockets, micro SMDs and more.

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With the manual Rework station Expert 05.6 IXH, MARTIN offers a cost-effective solution for the complete rework process, from desoldering, pad cleaning, positioning to soldering.

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