bondexpo16_01 14. Bondexpo – International trade fair for bonding technology

Date: 05/10/2021 - 08/10/2021
Location: Stuttgart, Deutschland
Location: Neue Messe Stuttgart

Meeting Place for the Industry of Bonding Technology. With a clear and consistent focus on the process chain of joining/bonding by means of gluing, moulding, sealing and foaming, detailed and system solutions are offered for present and future challenges in the field of joining and bonding the broadest range of materials.

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