EXPERT 10.6 IV

Adjustable 410 W under-heating system
Semiautomatic hybrid Rework station with adjustable heating system for the repair of small circuit boards, such as those found in smartphones.
Products in shop
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Top FeaturesCamera-supported Rework

Flexibility
Various PCBs and component sizes
Under-heating system
Flexible use of the heating system, used for mobile phones
Multifunctionality
One device for all processes, including desoldering, pad cleaning, automatic positioning and soldering
Process control
Automatic profiler for under- and top-heating system
Software
Simple, intuitive, tablet-compatible
Precision
Placement precision within 15 µm

Expert 10.6 IV

410 W Rework station with IR under-heating system (80 x 60 mm²) and automated SMD placement process by Auto Vision Placer (AVP) incl. software EASYSOLDER 07 and DBL 06 control unit with six high-resolution sensors inputs for thermocouples (Type K). This unit is particularly suitable for small PCBs found in smartphones and PDAs with fine-pitch components in varying package dimensions.

Product variations in the shop

DB00.1068
EXPERT 10.6 IV

IR rework station, 410W, autom. placement

Article Nr.: DB00.1068

Standard equipment

  • Tool set for dispensing, placing, residual solder removal and soldering with magazine
  • Set of placement nozzles (BGA/CSP) 3 mm, 5 mm, 8 mm, 10 mm
  • Set of soldering nozzles (CSP/QFN), 9 mm, 11 mm 13 mm, 16 mm
  • Set of soldering nozzles (SO) 10x15 mm², 15x25 mm²
  • Placement nozzle for manual placement of small components (0,5 mm)
  • Two camera lenses (BGA und CSP)
  • Two thermocouple sensors (type K)
  • Two PCB magnet holder 40.5 mm (standard)
  • PCB support rail 40.5 mm
  • Two PCB clips to install at hand rest
  • Foot switch
  • Rework ABC and manual
  • Intuitive software EASYSOLDER 07 with touch integration

Technical details

Power consumption:

1000 VA
Power solder pen:300 W, 35 l/min
Power under-heating system:110 W, 2 x IR-lamps
Size under-heating system:80 x 60 mm²
Max. PCB size:100 x 80 mm²
Resolution motion system:0,001 mm
 
Placement accuracy:± 0,015 mm(Flip Chip)*
± 0,030 mm(CSP)
± 0,040 mm(BGA)
 
High resolution CMOS-camera:5 Mio. Pixel, USB2
Camera field of view (FOV):14 x 18 mm²(Flip Chip)*
28 x 37 mm²(CSP)
37 x 50 mm²(BGA)
 
Mains:1 Phase, 230VAC, Fuse 16A
Pressurized air:5-8 bar, 100 l/minclean, dry air
Dimensions:865 x 460 mm²
 
* Optional extras

Downloads

Optional extras

SF64.0501
Tool Shuttle 32mm

for AVP 4.1

Article Nr.: SF64.0501
SF64.0525
Dip Tool 0.08mm with squeegee

for tool shuttle 32 / 40mm

Article Nr.: SF64.0525
SF64.0526
Dip Tool 0.15mm with squeegee

for tool shuttle 32 / 40mm

Article Nr.: SF64.0526
SF64.0527
Dip Tool 0.22mm with squeegee

for tool slider 32 / 40mm

Article Nr.: SF64.0527
SF64.0520
Print Tool with squeegee

for tool shuttle 32 / 40mm

Article Nr.: SF64.0520
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