rework - logo rework - claim
Rework | BGA Rework | CSP Rework | QFN Rework | Reballing | Prebumping | Dispensing | Dispenser | Cartridge | Dispensing nozzle | Dispensing needle | Solder paste | Solder balls | Flux | Flux Pen | Flux Creme | SMD Glue | Hand Soldering | Underheater | Solder Profile | Hot Air | Hot Air Soldering | Cleaning Fabric | Solder Rules |
Products Service Distributors About Us News  
 
 
Overview
MARTIN System Technology
Rework Technic pc
Rework Technic eco
Dispense Technic
Consumables
Soldering tools
Placment tools
Reballing/Prebumping tools

Solder Rules

MARTIN profiles are based on 5 solder rules. The software enables the operator to have a solder profile automatically created by the Easy Solder.

  • 1.PCBA and SMD are heated up by a rise below 3.5 K/s.
  • 2. The maximal temperature of the component is regulated to 260°C. If necessary, the user might adjust it to the requirements of the data sheet. /li>
  • 3.While lead free processes, a board temperature up to 190 °C is reached just by the preheater itself.
  • 4. The solder joint temperature at lead free soldering reaches temporary 230 °C. During leaded soldering the peak temperature of 205 °C is reached in the connections.
  • 5. All the solder joints of the edited component are exceeding 217 °C for a time between 40sec and 90sec, if the unit is lead free. The liquidus with 183 °C for leaded solder joints is overshoot by 25 sec to 90 sec.

No Damage with Auto Profiler Temperature Profile for Lead Free Rework
No Damage with Auto Profiler  >>
Temperature Profile for Lead Free Rework  >>
Press
Press releases
03/04 MARTIN Gives Lead Free a Helping Hand
Articles
It does everything
Smaller Process Window
Profile adopted by a click
 
SITEMAP   IMPRESSUM   HOMESITE   ©2010 MARTIN GMBH