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Exceeding the allowed gradients and maximal temperatures of components and board can easily be avoid by the help of a solder profile. Further a multi zone profile controls the homogeneous warming of the solder joints and guarantees the required time above the liquidus. Of course the activators of the flux are treated correctly during the preheating phase of a solder profile and the wetting of the connections is optimised by this way. Finally the profile regulates the cooling of the solder joints to minimise voids inside the lead.
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