MINIOVEN 05
For reball and reflow processes on BGA, CSP and QFN components at the best temperature distribution.
Top FeaturesHybrid heating technology for the best temperature distribution
MINIOVEN 05
The MINIOVEN 05 is a compact and robust table-top device specially designed for reballing of BGAs and prebumping of QFN components. The device is used in development and production. The efficient hybrid heating technology heats up electronic components evenly from all sides and thereby guarantees reproducible reballing results. Up to 25 heating profiles can be set up, administered and saved through the intuitive menu navigation. An additional external temperature sensor is used to ensure the highest possible reliability as the device automatically adjusts the reballing profiles. Through the sensor, the optimal profile settings for achieving the specified component temperatures are determined through the sensor. The EASYBEAM software allows for the convenient editing of reballing profiles as well as for the temperature history to be depicted. Aside from the reballing process for BGA components, there are also images and provisions available for the prebumping of QFN components. The device possesses a connection for process gas. This allows the reflow processes to be easily converted to nitrogen-based atmospheres.
Product variations in the shop
 | HB00.0025 | MINIOVEN 05, 230 V Basic Unit for Reballing and QFN Prebumping Article Nr.: HB00.0025 | |||||
| HB00.0027 | MINIOVEN 05, 115 V Basic Unit for Reballing and QFN Prebumping Article Nr.: HB00.0027 |
Standard equipment
- MINIOVEN 05 Base Unit
- Sensor for temperature (K-Type)
- Cutter knife
- SMD hook
- Cleaning pen with three spare inserts
- Capton tape
- Magnifier
- Power cable
- Manual
Videos
Reballing with the Minioven cuts cost and lead time by not outsourcing the product.
The Minioven offers a compact, fast, simple and economical solution for pre-bumping of QFNs.
Technical details
| Power consumption: | 550 VA | |
| Power heating system: | 500 W | 4 x IR-lamps |
| Size heating system: | 105 x 130 mm2 | |
| Temperature range: | 50 °C - 250 °C | |
| Number of temperature sensors: | 1 x internally inst. & 1 x external opt. | |
| Number of profiles: | 25 memory slots | |
| Max. component size: | 55 x 55 x 4 mm3 | |
| Mains: | 1 Phase, 230 VAC | |
| Dimensions: | 150 x 300 x 85 mm3 | |
| Weight: | 800 g |
Downloads
| Product flyer | 1.1 MB | Download |
Optional extras
 | HB50.0004 | Basic Equipment for MINIOVEN 04/05 Set clean pen,hook,tape,cutter,magnifier Article Nr.: HB50.0004 | |||||
| HB00.4005 | Process Gas Connection Set for Minioven 05 Article Nr.: HB00.4005 | |||||
 | HB00.0112 | Switch Box Process Gas including valve and connection set Article Nr.: HB00.0112 | |||||
 | VD90.5003 | Solder balls, 200µm (=1,4g), 50,000 pc Sn63Pb37, CSP Article Nr.: VD90.5003 | |||||
| VD90.5004 | Solder balls, 250µm (= 3,5g), 50,000 pc Sn63Pb37, CSP Article Nr.: VD90.5004 |
