Martin GmbH - Logo rework - claim
Rework | BGA Rework | CSP Rework | QFN Rework | Reballing | Prebumping | Dispensing | Dispenser | Cartridge | Dispensing nozzle | Dispensing needle | Solder paste | Solder balls | Flux | Flux Pen | Flux Creme | SMD Glue | Hand Soldering | Underheater | Solder Profile | Hot Air | Hot Air Soldering | Cleaning Fabric | Solder Rules |
Service Distributors About Us News  
 
 
Overview
MARTIN System Technology
    No Damage with Auto Profiler
 >  Safe, Novel Heating Technique
    Perfectly Controlled Dispensing
    MARTIN ABCs (PDF)
Rework Technic pc
Rework Technic eco
Dispense Technic
Consumables
Soldering tools
Placment tools
Reballing/Prebumping tools

Safe, Novel Heating Technique

Proper thermodynamics are undoubtely the key to restoring the quality of the original product.

No other system prevents pcb warping or popcorning better than the gentle combination technique developed by MARTIN.

Combination of IR and Hot Air
Homogeneous warming

Basic system

  • Gentle IR surface underheater brings the entire pcb to
    120°C.
  • Patented, precision topside heater to reach the reflow temperature.
  • Topside heater and underheater are ideally matched.
  • Perfectly controlled heating conditions prevent damage and errors.
Precision Hot Air

Convention heat for delicate jobs

  • Allows all balls to be heated to reflow temperature at virtually the same time.
  • Specially adapted air outlet openings in the convection topside heater prevent overheating of SMD centre.
  • Temperature differences within the SMD are negligible
    (+/-4 K).
Rapid IR

New infrared underheating

  • Uses six special quartz spot lamps.
  • Unique on the market.
  • Rapid response to the heating requirements.
  • Can be used with all MARTIN Rework Systems.
    Also available as a separate module.
   
 
SITEMAP   IMPRESSUM   HOMESITE   PRINT   DOWNLOAD PDF ©2010 MARTIN GMBH