BGA / CSP / QFN Rework + Dispense Technic: MARTIN Rework Set Expert 04.6 - Expert 04.6H specific

Rework | BGA Rework | CSP Rework | QFN Rework | Reballing | Prebumping | Dispensing | Dispenser | Cartridge | Dispensing nozzle | Dispensing needle | Solder paste | Solder balls | Flux | Flux Pen | Flux Creme | SMD Glue | Hand Soldering | Underheater | Solder Profile | Hot Air | Hot Air Soldering | Cleaning Fabric | Solder Rules |

Overview


MARTIN System Technology


Rework Technic pc


Rework Technic eco
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Dispense Technic


Consumables


Soldering tools


Placment tools


Reballing/Prebumping tools

MARTIN Expert-04.6
Cost Effective Rework for all SMD Components

MARTIN Expert 04.6H

Specific equipment

Instead of underheater IRF 02:
IRH radiaton element (110 W)
Instead of 7 soldering nozzles for QFPs:
Set with 4 soldering nozzles for all CSPs
1 soldering nozzle for SOs (15 x 15 mm)
CSP centering device

Specific technical data

Footprint		320 x 490 mm
Underheater		20 - 110 Watt 65 x 80 mm

Expert 04.6H



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Site Content

Rework for Improvers

Economic Placement

Professional Soldering

Optional Extras

Expert 04.6H specific

More Information

Expert 04.6
Expert 04.6H
Expert 04.6J
Hot Air Temperature Meter HTM 06
Lead Free Accessories

Press

Press releases
#29, Where Small Is Beautiful
#24, Hotprint Prebumping
#19, Rework for Achievers
#13, New Balls for QFN Rework
#05, Lead Free Trainings Sets
Articles
QFN rework procedures
Smaller Process Window

Contact


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