Rework
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BGA Rework
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CSP Rework
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QFN Rework
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Reballing
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Prebumping
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Dispensing
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Dispensing nozzle
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Dispensing needle
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Solder paste
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Solder balls
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Flux
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Flux Creme
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Hand Soldering
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Underheater
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Solder Profile
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Hot Air
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Cleaning Fabric
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Solder Rules
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Overview
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Article-List - REWORK TECHNIC eco
Packages
HA00.4055
Martin rework set Expert 04.5^
Chip, QFP, BGA, CSP, QFN, reballing
1 pieces
HA00.4065
Martin rework set Expert 04.6^
Chip, QFP, BGA, CSP, QFN, reballing
1 pieces
HA00.4068
Martin rework set Expert 04.6H^
Chip, QFP, CSP, QFN, for mobile phones...
1 pieces
HA00.4071
Martin rework set Expert 04.6J^
Chip, QFP, reballing
1 pieces
HA00.4072
Martin rework set Expert 04.6X 2000^
for Xbox repair (CPU, GPU, Memory)
1 pieces
HB00.0030
Martin rework set Reball 03.1^
BGA/CSP reballing and QFN prebumping
1 pieces
HB00.0031
Martin rework set Prebump 03.1^
QFN prebumping and BGA/CSP reballing
1 pieces
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