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Articles

MARTIN: New Balls For Reliable QFN Rework

Press release 4/2006

Weßling, August 2006. When electronic assemblies are reworked there should be no reduction in quality and reliability. This is why MARTIN has introduced new QFN Reballing Technology to allow desoldered and no longer useful QFN components (Quad-Flat-No-Lead) to be used again. This saves the user the investment costs of a dispenser, as the usual procedure in reworking QFNs involves the dispensing of solder paste.

New Balls Ensure Highest Precision

Desoldered QFN components that have only a small amount of residual solder attached to their contacts pose an unacceptable risk when re used without having been reballed. The forming of new solder joints that only rely on residual solder and flux does not satisfy current expectations in the electronics industry. MARTIN offers a cost effective alternative with corresponding templates and Hot Air Mini Ovens to reclaim otherwise useless scrap into fully functional components.

Ball versus Solder Paste

Normally solder paste has to be applied when reworking QFNs to fully restore functionality. This requires a suitable dispenser, which is beyond the available budget of some small companies. MARTIN Reballing provides a professional and valuable alternative. Reclaiming desoldered components is carried out easily and accurately and ensures reliable soldering results. Naturally, all this also applies to CSP and BGA components.

Cost Effective

MARTIN supplies the Mini Ovens and corresponding Templates, which can be used with any MARTIN hot air work stations.
QFN Reballed
QFN Reballed

MARTIN GmbH

MARTIN GmbH, based in Weßling near Munich, Germany, has been developing, producing and selling rework and dispensing equipment for the repair and assembly of electronic assemblies for over 24 years. With the current staff of around 30 MARTIN is one of the leading suppliers of Rework and Dispensing Technology. Further information is available from the website: www.martin-smt.de.
   
 
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