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| Exhibitions |  |  | | Press releases | | |
#36, 2010 VISION Award |
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#35, Drop by Drop |
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#34, New heads at MARTIN |
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#33, The New Gold Standard |
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#32, For the Joy of the PCB |
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#31, Pastures New |
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#30, Detailed Perfection |
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#29, Where Small Is Beautiful |
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#28, Hot Beam 05 from MARTIN |
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#27, Very compact: Hot Plate 04 |
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#26, Increase |
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#25, Partner Meeting 2008 |
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#24, Hotprint Prebumping |
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#23, The Solution for QFN Rework |
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#22, New Rapid-Technology |
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#21, Guide Lines for Exhibitions |
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#20, 25 Years Martin |
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#19, Rework for Achievers |
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#18, Advanced Placement |
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#17, Speed for Lead Free |
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#16, Room For Jumbo PCBs |
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#15, All-In-One Set Reball-03.1 |
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#14, Assisted Parking |
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#13, New Balls for QFN Rework |
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#12, Dream Team for QFNs |
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#11, Positive Quarterly Figures... |
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#10, Innovative Rapid-IR... |
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#09, Auto-Vision-Rework... |
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#08, One for All |
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#07, MARTIN Process Dispenser |
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#06, Lead Free Manual Soldering |
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#05, Lead Free Trainings Sets |
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#04, Asia Loves the AVP |
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#03, Helping Hand for Lead Free |
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#02, Precise Dots on a Slope |
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#01, Ideal Environment |
 |  | | Articles |  |  |
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MARTIN Develops Innovative Rapid-IR Underheater |
Manual Soldering Without Temperature Stress |
Press release 1/2006 |
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Wessling, March 2006.
The compact Hot-Beam-03 Underheater, newly developed by MARTIN, uses Rapid-IR Technology, which offers the user significantly faster and relaxed manual soldering. With lead free solder requiring a soldering iron tip temperature increase of 50°C, causing higher wear and shorter useful life, Hot-Beam-03 now solves the problem by splitting the heat energy input equally between top and bottom. This has the advantage of providing improved wetting of solder joints, longer solder tip life and protection of components.
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Relief of Thermal Pressure on Solder Tips |
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Anyone investing in new soldering equipment has to take account of EU Guidance 2002/95/EG. For soldering stations this means an increase in soldering iron tip temperature of approximately 50°C. The patent applied for Rapid-IR Technology of the Hot-Beam-03 heats the board at the maximum permitted rate and maintains the PCB at a predetermined temperature of up to 150°C. This underheater avoids components overheating, improves wetting and significantly extends solder tip life.
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Simple Use in Confined Spaces |
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The compact Hot-Beam-03 Underheater, measuring only 290x140x40 mm, can be found space even on the smallest workbench. A number of different variants are available for supporting printed circuit boards. The new Handy-Fix-03K consists of a static safe base plate and a magnetic adjustable board clamp. PCBs are located there by spring clips, which make locating boards even simpler for users.
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Improvement in Solder Joint Wetting |
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The Hot-Beam-03 reduces the required soldering iron tip temperature. This also prolongs flux life during soldering, as it is not used up as quickly. Especially during the phase of wetting the solder joint, flux is still present in sufficient quantities.
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Hot-Beam-03
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Cost Reduction and Improved Quality |
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The use of the Hot-Beam-03 can contribute significantly to cost minimisation in lead free hand soldering.
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