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| Exhibitions |  |  | | Press releases | | |
#36, 2010 VISION Award |
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#35, Drop by Drop |
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#34, New heads at MARTIN |
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#33, The New Gold Standard |
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#32, For the Joy of the PCB |
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#31, Pastures New |
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#30, Detailed Perfection |
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#29, Where Small Is Beautiful |
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#28, Hot Beam 05 from MARTIN |
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#27, Very compact: Hot Plate 04 |
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#26, Increase |
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#25, Partner Meeting 2008 |
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#24, Hotprint Prebumping |
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#23, The Solution for QFN Rework |
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#22, New Rapid-Technology |
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#21, Guide Lines for Exhibitions |
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#20, 25 Years Martin |
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#19, Rework for Achievers |
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#18, Advanced Placement |
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#17, Speed for Lead Free |
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#16, Room For Jumbo PCBs |
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#15, All-In-One Set Reball-03.1 |
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#14, Assisted Parking |
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#13, New Balls for QFN Rework |
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#12, Dream Team for QFNs |
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#11, Positive Quarterly Figures... |
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#10, Innovative Rapid-IR... |
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#09, Auto-Vision-Rework... |
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#08, One for All |
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#07, MARTIN Process Dispenser |
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#06, Lead Free Manual Soldering |
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#05, Lead Free Trainings Sets |
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#04, Asia Loves the AVP |
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#03, Helping Hand for Lead Free |
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#02, Precise Dots on a Slope |
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#01, Ideal Environment |
 |  | | Articles |  |  |
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One for All - Effective Rework |
Press realese 4/2005 |
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Trust in the reliability of a process is one thing, the ease of use of a rework station and to get the best from it without prolonged instructions, sometimes is entirely a different matter. One solution, concentrating on the essentials, manages both and converts even demanding tasks into ones easily accomplished.
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Placement systems which often rely on split field technology have one problem: the accuracy shown in aligning components and pads is only make belief, as the actual placement accuracy depends largely on the elaborate mechanical calibration of the optical paths. Additionally, an uncontrolled 'blind' movement then follows the manual alignment. This is the staring point of the patented Auto-Vision technology from Martin. From the first to the final moment the camera observes and precisely regulates the placement motion. The accuracy is solely dependent on the faultless resolution of the camera and not on mechanical accuracies. This represents an advanced development that also brings with it considerable cost savings.
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Precision Hot Air |
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The so-called Zero Risk Rework for risk free heating technology is based on immutable physical laws. Even more notice of them is required when dealing with ever reducing process windows. Soldering demands absolute reliance on the successful interplay between the patented Precision Hot Air for detailed work from above and the Rapid IR Underheater for background heat for the whole of the board underside.
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Illustration 1: The Auto-Vision-Expert-09.5 from Martin
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Flexible Use |
The Auto-Vision-Expert-09.5 (Illustr 1) is designed for very small printed circuit boards up to dimensions of 500 or 600mm (XL version). This is made possible by the flexible PCB supports, a size adjustable area underheater IRF or the smaller IR heater.
The rework station can be adjusted to suit any imaginable SMD types and sizes within just a few seconds. In the range of 1 to 55mm only the placement and soldering nozzles and occasionally the lens need to be changed. All seven functions are combined in one rework unit:
- Desoldering,
- Residual Solder Removal,
- AVP Placement,
- Soldering,
- Dispensing,
- Reballing and
- LPCB Identification.
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Clarity for Operators |
Easy-Solder-05 is the intelligent user software behind the completely PC controlled work station. Suited to modern requirements, with more clarity, aimed specifically at particular process steps and with more visual support it is, therefore, even faster than before. For Quality Control the optional extra 'Report' automatically records all salient data and pictures in the background, saving them in compressed monthly files. The three clicks process selection:
- Selection of PCB,
- Selection of SMD,
- Selection of process and start.
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For clarification the monitor shows the selected board, the placement position and the required soldering nozzle (Illustr 2). In addition, the program provides clear instructions as to the next action at each step. Users are supported at decisive points by control questions and camera images.
New soldering tasks are made easy with the integrated Auto-Profiler. A new profile is automatically established within 3 minutes, without any precondition.
- When selecting the soldering nozzle the system allocates certain settings.
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Users only need to apply temperature sensors to the PCB and component and detect the melting point by use of the SMD Hook.
All required parameters are then established automatically in one soldering cycle.
Previous versions of soldering profiles can also be imported without problem.
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Illustration 2: Three clicks and you're there
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Precise Placement |
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The Auto-Vision-Placer controls and calculates the automatic placement process from beginning to end, thanks to the camera. The corner points for the component position and the placement location are registered by mouse clicks. A magnified section of the screen makes the establishing of these points particularly easy. The processor automatically calculates the exact movement coordinates while the camera regulates and checks the movement right to the last moment.
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Illustration 3: Only OK initiates the next step
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Thermodynamics taken literally |
Martin's thermodynamics strategy is based on two components:
the fast acting IR area underheater provides background heat to the whole of the PCB. This supplies half the energy required at the soldering point and avoids board distortions or twisting.
With significantly greater technical effort, and at the same time, energy is delivered accurately from the top to the solder joints. The homogeneous temperature distribution across the SMD is within 4șC and remains consistent to ±1%, without the need for an operator to do any calibration. To comply with ISO 9000ff the Soldering Pen can be cost effectively exchanged annually or recertified locally by use of set Easy-Cal III.
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Rapid Infrared Underheater |
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This newly developed Rapid IR Technology transfers within a few seconds the programmed background heat into the board, without exceeding the permitted ramp rate of 3.5șC/sec. This allows the reduction of hot air temperatures for the top convection heating and provides for the gentlest of processing.
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