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QFN - Printing

APP-Tool Process

When reworking SMDs, whose contacts have not been previously solder coated, this has to be applied first. A typical example is a QFN component. The process requirements are that residual solder cannot be re used, it is in fact removed and the pads are thoroughly cleaned. The challenge is to apply fresh paste for the solder process. Because of space restrictions printing solder paste directly onto the board surface is usually not possible. Printing fresh solder paste onto the QFN contacts, however, is a viable option.
The Print Tool offers further process safety and increased productivity.



Avaliable for: EXPERT 10.6