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BGA Flux-Dipping

with APP-Tool

The use of fluxes in rework is unavoidable, as they substantially improve solder wetting and flow. Both properties are important for safe desoldering and replacement of components as well as cleaning of pads. In original assembly processes flux is usually applied by printing as a constituent of solder paste and almost completely dissipates during reflow. Things are different when reworking BGAs / CSPs. Fluxes are commonly applied manually and since the whole of the board is not heated to solder temperatures residues remain. These deposits can adversely affect the longevity of solder joints and should be avoided. Correct quantities of flux, in the right places, can be applied with the aid of the Dip Tool.

 





Avaliable for: EXPERT 10.6