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APP Tools

App Tools support important steps in the REWORK process and ensure reproducibility and reliability.  APP Tools can be used with the Rework Systems of the EXPERT 10.6 Family; the mechanical components of their current AVP Systems are already prepared and allow easy integration.   

Print Tool

When reworking SMDs, whose contacts have not been previously solder coated, this has to be applied first. A typical example is a QFN component. The process requirements are that residual solder cannot be re used, it is in fact removed and the pads are thoroughly cleaned. The challenge is to apply fresh paste for the solder process. Because of space restrictions printing solder paste directly onto the board surface is usually not possible. Printing fresh solder paste onto the QFN contacts, however, is a viable option.
The Print Tool offers further process safety and increased productivity.

 

  • Print Tool, Stencil, QFN
  • Assembled Tool
  • QFN Pick-Up by Vaccum Nozzle
  • Printed QFN
  • QFN with Paste over PCB

What’s needed:

  • No smudging of solder paste while handling QFNs, for example when lifting component from stencil and transporting to placement location. 
  • Great flexibility, as QFNs are available in many different versions.
  • Simple handling of tools. 
  • Solder Paste printing outside machine incrteases productivity. 
  • Stencil and holder must be easy to separate to facilitate cleaning. 

 

 

Dipp Tool

The use of fluxes in rework is unavoidable, as they substantially improve solder wetting and flow. Both properties are important for safe desoldering and replacement of components as well as cleaning of pads.
In original assembly processes flux is usually applied by printing as a constituent of solder paste and almost completely dissipates during reflow. Things are different when reworking BGAs / CSPs. Fluxes are commonly applied manually and since the whole of the board is not heated to solder temperatures residues remain. These deposits can adversely affect the longevity of solder joints and should be avoided. Correct quantities of flux, in the right places, can be applied with the aid of the Dip Tool.

 

  • Dipp Tool, Chip Frame, BGA
  • Assembled Tool

  • Mobile CPU Dipped in Flux
  • Mobile CPU at Nozzle

What’s needed: 

  • Tools with varying depths to accommodate all solder ball diameters; Rule of thumb: immersion depth ~ 1/3 ball diameter.
  • Preparation of tooling, e.g. loading component, charging of flux tray … is done outside the machine to maximise productivity. 
  • Storage of tools outside the machine so that fluxes do not get heated unnecessarily.
  • Simple and intuitive handling.
  • Tooling for ideal pre arrangement of SMDs with chip frames.
  • Tools can also accept desoldered devices. 
  • Dipping of Flux and Solder Paste. 

µSMD Tool

Developments in the manufacture of components have led to ever smaller devices, which often present particular challenges in rework. In addition to passive SMDs, active components of only 2x2mm in size are available and being used. Automated assembly processes can cope with these sizes, whereas the manual handling of such SMDs with a vacuum pen requires extraordinary operator skill and dexterity. The µSMD Tool enables any equipment user to manage rework processes safely and reproducibly.

 

Avaliable for: EXPERT 10.6