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Flux / Glues

Flux Creme, Flux Pen, SMD Adhesive

In electronic manufacturing flux is necessarily required. It improves wetting properties of solder material during reflow. Flux activates at a specific temperature in heating ramp-up and hence is designed for lead free and leaded applications differently. Therefore flux should be used according its specification only. 

MARTIN fLux is available in paste / crème or in liquid type (Flux Pen). In solder paste, flux works as the basic component where the metal powder is mixed in.All MARTIN flux products are compliant to DIN EN 29454-1, bzw. JST-04, JST-05 and are free of halogen and do not require cleaning (no clean). Never the less the use of flux should be minimal.  

Flux Creme for lead-free applications

  • HT00.0116
  • HT00.0119
  • HT00.0117

Conformity: DIN EN 29454-1, ANSI JST- 004/-005
Activation Level: REL 0
Cleaning Recommendation: "no clean"

To be used in all electronic solder applications with lead-free solder.

Item#
Packaging
HT00.0116 5ccm / cartridge
HT00.0119 18g / box
HT00.0117 100g / box

Flux Creme for leaded applications

  • HT00.0116
  • HT00.0119
  • HT00.0117

Conformity: DIN EN 29454-1, ANSI JST- 004/-005
Activation Level: REL 0
Cleaning Recommendation: "no clean"

 

To be used in all electronic solder applications with leaded solder.

Item#
Packaging
HT00.0016 5ccm / cartridge
HT00.0017 100g / box

Flux Pen for leadfree applications

Conformity: DIN EN 29454-1, ANSI JST- 004/-005
Activation Level: REL 0
Cleaning Recommendation: "no clean"
  

To be used in all electronic solder applications with leadfree solder.

Item#: HT00.0009    

Flux Pen for leaded applications

Conformity: DIN EN 29454-1, ANSI JST- 004
Activation Level: REL 0
Cleaning Recommendation: "no clean"

To be used in all electronic solder applications with leaded solder.


Item#: HT00.0010    

SMD Adhesive

SMD Adhesive
5 ccm, D 125 F-DR

Item#: VD90.1009    

Spray for cleaning Flux

Spray for cleaning Flux

Item#: VD90.0153