Heating TechnologyFrom IR to HYBRID
All MARTIN rework stations simultaneously heat assemblies from above and below. Top heating is always hot gas/gas. MARTIN offers different under heating technologies in various power ratings (from 110W-10.000W) that are especially suited to particular applications in the range of EXPERT 10.6 workstations.
Various technologies in MARTIN machines
For medium and large boards (i.e. Power Electronics, Server, Telecommunication) the patented Hybrid Technology offers uniform and gentile heating. Because of the combination of IR and hot gas heat is transferred very efficiently to the boards. Warping, caused by temperature differences, is reduced to a minimum. Discolouration and permanent distortion, due to local overheating, are avoided. Especially when dealing with LEDs, Server Boards or assemblies from the automotive sector, where printed circuit boards often have a lot of thermal mass, Martin’s Hybrid Technology is particularly suitable because of its excellent heat transfer ability.
For small boards (~80x110mm²), as, for example, in mobile phones, sensor or medical applications, the compact infra red Underheater IRH is recommended. The unique properties of the fast responding and precise controllable IRH-radiator is requested here. Hence for each application the right bottom heater technology is available.
Hot Gas Technology
With all EXPERT configurations Hot Gas Technology is provided for heating components from the top. Hot Gas, as a means of transferring heat, is very efficient and can be precisely controlled. Soldering nozzles direct the heated gas to where it is needed. This can be very different from one component to another: SMD-LED, BGA, CSP, QFN, SO, DIMM, THT, Connector, Sockets. The design of the soldering tools is such that heating takes place uniformly across the components and that all solder joints reach the soldering temperature simultaneously. The right nozzle makes the reflow process to be as gentle as possible to the component, the adjacent components and to the PCB.
IR-Convection Technology for MINIOVEN 04
The compact table top reflow system MINIOVEN 04 uses a powerful IR radiator for heating up SMT components. Whereby components are not exposed direct IR radiation but receive heat through a combination of hot air and diffuse scattered IR radiation. The patented IR-hot-air system realizes a balanced and controlable reflow process. It benefits especially large size component reballing and multi-component QFN prebumping.
To reduce oxidisation of the solder and to increase the quality of the solder surface the oven chamber can be flooded with a protective atmosphere, e.g. nitrogen (MINIOVEN 04/N).