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Rework Station EXPERT 10.6

Rework of BGA, CSP and QFN

The rework stations facilitates the reliable and precise rework of BGA-, CSP-, and QFN-components, connectors and sockets. Innovative technologies such as “Advanced Vision Placement”, Hybrid Heating Technology and the intuitively operated “Easy Solder” software ensure safe soldering and de-soldering without the intervention of operators in the soldering process.

  • Rework of SMD USB-Socket on Mainboard
    Rework of SMD USB-Socket on Mainboard

These compact rework stations are, in addition to soldering and de-soldering, suitable for removing residual solder and for dispensing fluxes and solder pastes.  With the software “Easy Solder” all rework profiles are easily managed.

The EXPERT 10.6 product family offers a comprehensive selection of Hybrid and IR Underheaters to ensure ideal conditions for the different rework applications.  MARTIN offers different options and tools to get the best from the equipment in each application.

EXPERT 10.6 Rework Stations

 
Rework Station for Large BGAs and Sockets with very large size Hybrid-Bottom-Heater

EXPERT 10.6 HXXV

Semi-automated hybrid-rework system for CSP, BGA, sockets, connectors, etc. with additional functions solder removal and dispense. Designed and optimized for rework of very large size PCB.

Bottom heater (hybrid):

3000W - 10000 W

Top heater (hot gas):

300 W

Board size (max):

530 mm x 710 mm

Foot print:

13000 mm x 900mm

BGA- and Socket-Rework Station with large size Hybrid-Bottom-Heater

EXPERT 10.6 HXV

Semi-automated hybrid-rework system for CSP, BGA, sockets, connectors, etc. with additional functions solder removal and dispense. Designed and optimized for rework of large size PCB.

Bottom heater (hybrid):

1200 W - 5000 W

Top heater (hot gas):

300 W

Board size (max):

480 mm x 480 mm

Foot print:

1030 mm x 630 mm

CSP-, BGA-Rework Station with Hybrid Bottom Heater

EXPERT 10.6 HV

Semi-automated hybrid-rework system for QFN, CSP, BGA, sockets and connectors with additional functions solder removal and dispense. Designed and optimized for rework of mid size PCB.

Bottom heater (hybrid):

600 W - 3000 W

Top heater (hot gas):

300 W

Board size (max):

300 mm x 300 mm

Foot print:

865 mm x 460 mm

CSP QFN rework station with IR Bottom Heater

EXPERT 10.6 IV

Semi-automated rework system for QFN and CSP with additional functions solder removal and dispense. Designed for rework of small PCB like from smart phones, tablet PC or sensor applications.

Bottom heater (IR):

110 W

Top heater (hot gas):

300 W

Board size (max):

80 mm x 100 mm

Foot print:

600 mm x 360 mm

Application

Typical Application of EXPERT 10.6 rework stations are - dependend on the configuration - the repair f smart phones, industrial electronics, comodity products, server and telecommunication boards.

  • 10.6 HV -> BGA, CSP, SO, QFN, Sockets, Plugs, Shields, From 0201 to 40x40mm.
  • 10.6 HXV -> BGA, CSP, SO, Sockets, Plugs, From 0804 to 48x48mm.
  • 10.6 HXXV -> BGA, CSP, SO, QFN, Sockets, Plugs, Shields, From 0804 to 48x48mm.

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