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Solder Pastes

Lead-free and leaded Solder pastes

MARTIN solder pastes are compatible to standards in electronic manufacturing. Both leaded and lead free versions are available. Solder pastes are available in particle sizes ranging from Type 3 to Type 6 powders for standard and super fine pitch requirements. They are available in small volumes perfect to use for repair purposes. 

MARTIN solder pastes are evaluated especially for dispensing applications with time pressure dispense systems. Beside excellent dispensing, they deliver superb solder results due to outstanding wetting and void performance. Best parameter for dispensing can be communicated on request. 

Lead-free Solder Pastes

  • VD90.0320
  • VD90.0230
  • VD90.0315

Lead-free solder pastes for dispense applications.

 

Item#
Alloy
Type
Flux
Particle Size [µm]
Applications
VD90.0320 Sn95.5Ag4Cu Finepitch-3 ROL0 25-45 Dispensing with
nozzle diameter 0,3 - 0,4 mm
VD90.0230 Sn96,5Ag3Cu Finepitch-4 ROL0 20-38 Printing of
QFN chips
VD90.0315 Sn96,5Ag3Cu Super-
Finepitch-6
ROL0 5-15 Dispensing with
nozzle diameter 0,14 - 0,2 mm

Leaded Solder Pastes

  • VD90.0420
  • VD90.0035
  • VD90.0115

Leaded solder pastes optimally suitable for dispense applications.

 

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Item#
Alloy
Type
Flux
Particle Size [µm]
Applciations
VD90.0420 Sn62Pb36Ag Finepitch-3 ROL0 25-45 Dispensing with
nozzle diameter 0,3 - 0,4 mm
VD90.0035 Sn62Pb36Ag2 Finepitch-5 ROL1 10-25 Dispensing with
nozzle diameter 0,2 - 0,3 mm
VD90.0115 Sn62Pb36Ag Super-
Finepitch-6
ROL0 5-15 Dispensing with
nozzle diameter 0,14 - 0,2 mm