Search results"solder"
HB00.1005 | Table mount (flush mount) HOTBEAM 04/ HOTPLATE Installation set incl. cover panel Article Nr.: HB00.1005 | ||||||
HB00.1010 | Table mount (flush mount) HOTBEAM 05 Installation Set incl. cover panel Article Nr.: HB00.1010 | ||||||
HB00.0025 | MINIOVEN 05, 230 V Basic Unit for Reballing and QFN Prebumping Article Nr.: HB00.0025 | ||||||
HB00.0027 | MINIOVEN 05, 115 V Basic Unit for Reballing and QFN Prebumping Article Nr.: HB00.0027 | ||||||
HB00.0053 | HOTBEAM 05 - 2000 W, 230 V 185*245 mm, 4 pcb holder+rail, t, sensor Article Nr.: HB00.0053 | ||||||
HB00.0054 | HOTBEAM 05 - 2000 W, 115 V 185*245 mm, 4 pcb holder+rail, t, sensor Article Nr.: HB00.0054 | ||||||
HB00.0050 | HOTBEAM 04 - 500 W, 230 V 105*130 mm, 4 pcb support, tape, sensor Article Nr.: HB00.0050 | ||||||
HB00.0051 | HOTBEAM 04 - 500 W, 115 V 105*130 mm, 4 pcb support, tape, sensor Article Nr.: HB00.0051 | ||||||
HB00.0041 | HOTPLATE 04 - 700 W, 230 V 125*115 mm Article Nr.: HB00.0041 | ||||||
HB00.0042 | HOTPLATE 04 - 700 W, 115 V 125*115 mm Article Nr.: HB00.0042 | ||||||
DS01.4001 | SMART DESOLDER 01 with HOTBEAM 04 - 230 V Article Nr.: DS01.4001 | ||||||
DS01.4002 | SMART DESOLDER 01 with HOTBEAM 04 - 115 V Article Nr.: DS01.4002 | ||||||
DS01.4003 | SMART DESOLDER 01 with HOTBEAM 05- 230 V Article Nr.: DS01.4003 | ||||||
DS01.4004 | SMART DESOLDER 01 with HOTBEAM 05- 115 V Article Nr.: DS01.4004 | ||||||
DL08.0000 | DOTLINER 08 with dispensing head 5 ccm Article Nr.: DL08.0000 | ||||||
VD90.0035 | Solder paste 5ccm super finepitch 5 Sn62Pb36Ag2,ROL1 / particle size 10-25µm Article Nr.: VD90.0035 | ||||||
VD90.0230 | Solder paste print 5ccm finepitch type 4, lead-free Sn96.5Ag3Cu, ROL0 / 20-38µm Article Nr.: VD90.0230 | ||||||
VD90.0320 | Solder paste 5ccm finepitch type 3, lead-free Sn95.5Ag4Cu,REL0 / particle size 25-45µm Article Nr.: VD90.0320 | ||||||
VD90.5003 | Solder balls, 200µm (=1,4g), 50,000 pc Sn63Pb37, CSP Article Nr.: VD90.5003 | ||||||
VD90.5004 | Solder balls, 250µm (= 3,5g), 50,000 pc Sn63Pb37, CSP Article Nr.: VD90.5004 | ||||||
VD90.5005 | Solder balls, 300µm (= 6g), 50,000 pc Sn63Pb37, CSP Article Nr.: VD90.5005 | ||||||
VD90.5008 | Solder balls, 400µm (= 14g), 50,000 pc Sn63Pb37, CSP Article Nr.: VD90.5008 | ||||||
VD90.5010 | Solder balls, 450µm (= 20g), 50,000 pc Sn63Pb37, CSP Article Nr.: VD90.5010 | ||||||
VD90.5009 | Solder balls, 500µm (= 27g), 50,000 pc Sn63Pb37, CSP Article Nr.: VD90.5009 | ||||||
VD90.5006 | Solder balls, 600µm (= 47g), 50,000 pc Sn63Pb37, BGA Article Nr.: VD90.5006 | ||||||
VD90.5001 | Solder balls, 762µm (= 96g), 50,000 pc Sn63Pb37, BGA Article Nr.: VD90.5001 | ||||||
VD90.5103 | Solder balls, 200µm (=3g), 50,000 pc Sn96.5Ag3Cu0.5, lead-free CSP Article Nr.: VD90.5103 | ||||||
VD90.5104 | Solder balls, 250µm (=3g), 50,000 pc Sn96.5Ag3Cu0.5, lead-free CSP Article Nr.: VD90.5104 | ||||||
VD90.5105 | Solder balls, 300µm (=5.2g), 50,000 pc Sn96.5Ag3Cu0.5, lead-free CSP Article Nr.: VD90.5105 | ||||||
HT00.0010 | Flux Pen F-SW34, no clean, L3 Article Nr.: HT00.0010 | ||||||
DV15.0117 | Solder removal nozzle 0.5mm, type II, complete for µSMD/CSP/QFP Article Nr.: DV15.0117 | ||||||
DV15.0114 | Solder removal nozzle 1.0mm, type II, complete for µSMD/CSP/QFP Article Nr.: DV15.0114 | ||||||
DV15.0110 | Solder removal nozzle 1.4mm, type II, complete Article Nr.: DV15.0110 | ||||||
DV15.0116 | Teflon tip 0.5mm for solder removal nozzle type II for use with glass tube 27mm Article Nr.: DV15.0116 | ||||||
DV15.0115 | Teflon tip 1.0mm for solder removal nozzle type II for use with glass tube 27mm Article Nr.: DV15.0115 | ||||||
DV15.0011 | Teflon tip 1.4mm for solder removal nozzle type I Article Nr.: DV15.0011 | ||||||
DV15.0111 | Teflon tip 1.4mm for solder removal nozzle type II for use with glass tube 27mm Article Nr.: DV15.0111 | ||||||
DV15.0021 | Glas tube 27mm for solder removal nozzle type II 1.4 / 1.0 / 0.5mm Article Nr.: DV15.0021 | ||||||
DV15.0112 | Solder separator for solder removal nozzle type II 1.4 / 1.0mm (with 5 masks) Article Nr.: DV15.0112 | ||||||
DV15.0102 | Cleaner for solder removal nozzle type II 1.4 / 1.0mm Article Nr.: DV15.0102 | ||||||
LW40.0134 | Soldering nozzle set CSP/QFN 4 closed closed version, 4 pieces Article Nr.: LW40.0134 | ||||||
LW40.1103 | Soldering nozzle set BGA 4 4 pieces (15*15, 27*27, 35*35, 40*40) Article Nr.: LW40.1103 | ||||||
LW01.0015 | Solder nozzle QFP 15*15mm for PLCC32, QFP48s Article Nr.: LW01.0015 | ||||||
LW01.0020 | Solder nozzle QFP 20*20mm for PLCC44, QFP92 Article Nr.: LW01.0020 | ||||||
LW01.0026 | Solder nozzle QFP 20*26mm for FP100 Article Nr.: LW01.0026 | ||||||
LW01.0025 | Solder nozzle QFP 25*25mm for PLCC68, QFP132 Article Nr.: LW01.0025 | ||||||
LW01.0030 | Solder nozzle QFP 30*30mm für PLCC84, QFP208 Article Nr.: LW01.0030 | ||||||
LW01.0036 | Solder nozzle QFP 36*36mm for QFP240 Article Nr.: LW01.0036 | ||||||
LW01.0045 | Solder nozzle QFP 45*45mm for QFP308 Article Nr.: LW01.0045 | ||||||
LW40.0111 | Solder nozzle CSP/QFN 09*09mm for CSPs and QFNs, with spring Article Nr.: LW40.0111 | ||||||
LW40.0112 | Solder nozzle CSP/QFN 11*11mm for CSPs and QFNs Article Nr.: LW40.0112 | ||||||
LW40.0114 | Solder nozzle CSP/QFN 13*13mm for CSPs and QFNs Article Nr.: LW40.0114 | ||||||
LW40.0116 | Solder nozzle CSP/QFN 16*16mm for CSPs and QFNs Article Nr.: LW40.0116 | ||||||
LW40.5000 | Solder nozzle CSP/QFN with vacuum 09*09mm for CSPs and QFNs Article Nr.: LW40.5000 | ||||||
LW40.5001 | Solder nozzle CSP/QFN with vacuum 11*11mm for CSPs and QFNs Article Nr.: LW40.5001 | ||||||
LW40.5002 | Solder nozzle CSP/QFN with vacuum 13*13mm for CSPs and QFNs Article Nr.: LW40.5002 | ||||||
LW40.5003 | Solder nozzle CSP/QFN with vacuum 16*16mm for CSPs and QFNs Article Nr.: LW40.5003 |