Category: News
PoP Software
EXPERT 10.6 series
Wessling, November 2011. The newest challenge directed at the Engineers of Rework Specialists MARTIN in Wessling concerned components in the form: Package on Package (PoP), which are mostly used in mobile phones because of the limited space available. These packages often consist of two or three stacked BGAs.
When repairing such arrangements it is quite common to have to desolder and remove each layer separately. Extraordinary requirements are placed on the temperature regulation and the whole of the equipment control to avoid overheating any components or boards and to be able to ‘peel off’ one layer at a time.
The new MARTIN Software Easy Solder facilitates this application and extends the use of Martin’s EXPERT 10.6 series of rework stations.