MARTIN’s newest Desoldering Tools

The challenge in reworking these components lies with the direct thermal link between Exposed Pads and the Ground Plane of printed circuit boards.  This has the effect of the components to be reworked cooling so quickly that in any, even short pause between heating and lifting the solder solidifies. 

MARTIN’s new combined Soldering-Pickup-Tooling addresses this problem by switching on the vaccum as soon as the heating phase is complete. The component is lifted immediately, thus ensuring that no damage to components or printed circuit boards occurs.