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Wednesday, 26. April 2017

SMART DESOLDER 01
We offer an innovative solution to gently extract residual solder

SMART DESOLDER 01

Germering, April 2017. In the SMART DESOLDER 01 MARTIN combines a manual hot-gas source with a vacuum pen for noncontact extraction of residual solder. The new device will be presented at the SMT in Nuremberg from 16 to 18 May...Read more

Category: News

Monday, 27. February 2017

Volumetric Dispensing

Professional Dispensing in Engineering Wessling, November 2016. The dispensing specialist MARTIN expands their portfolio by the high-end dispensing device PROFI DISPENSE 06, specially designed for application in automation...Read more

Category: News

Friday, 24. February 2017

High-Level Dispensing

MARTIN provides constant temperature conditions Wessling, March 2016.At the SMT Nuremberg 2015 the Rework + Dispense Specialist MARTIN GmbH presented their advancements in dispense technology for the first time. Meanwhile the...Read more

Category: News

Tuesday, 23. February 2016

A woman at the top
Carlotta Baumann takes over the Management of the MARTIN GmbH

Wessling, February 2016. Carlotta Baumann succeeds Felix Frischkorn who managed the company since it was taken over by Finetech GmbH & Co. KG in 2010. Thus, for the first time a woman is head of the rework and dispense specialist...Read more

Category: News

Monday, 19. October 2015

Automatic Dispensing made easy
Fine Dispensing with the DOTLINER

Wessling, August 2015. The trend towards increasingly small structures and integration of functionality in PCBs is challenging for dispensing systems. Read more

Category: News

Thursday, 24. September 2015

Turning old into new

Using the MINIOVEN 05 for BGA reballing! Wessling, July 2015. Reballing valuable BGA modules becomes increasingly important. For many years now, BGA modules are successfully reballed using the flexible MINIOVEN desktop...Read more

Category: News

Thursday, 16. April 2015

MARTIN and Dispensing:

The Ideal Combination... Wessling, March 2015. Advanced and more complex electronic assemblies continue to present new technical challenges. At the 2015 SMT Hybrid Packaging exhibition in Nuremberg on 05 - 07 May, the Rework...Read more

Category: News

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